Colorful April, good news comes frequently! Recently, Shengjian has achieved another success in the field of pan-semiconductor wet electronic chemical supply and recycling system services, and successfully won the bid for Guangzhou Guangxin Packaging Substrate Co., Ltd.'s "Semiconductor High-end Flip Chip Packaging Substrate Product Manufacturing Project G3 Chemical Distribution Project" .

Shengjian has been seizing the market opportunities brought by the national "green low-carbon circular development" and "pan-semiconductor industry localization" strategies, working hard and continuing to increase the research and development of wet electronic chemical supply and recycling system products. , constantly dig into the potential needs of customers and provide more targeted overall system solutions. Winning the bid for this project is the customer's great affirmation of Shengjian's comprehensive strength and further consolidates Shengjian's brand influence. Shengjian will use this as a driving force to devote itself to project construction with a high-standard and strict "craftsmanship" attitude. Deliver another high-quality project to Shengjian.

It is reported that Guangzhou Guangxin Packaging Substrate Co., Ltd. is building a Guangxin semiconductor packaging substrate product manufacturing project with a land area of ​​approximately 140,000 square meters and building packaging substrate production plants and supporting facilities. The project has a total investment of approximately 5.8 billion yuan and will be constructed in two phases. At present, some of the main structures of the factories and supporting facilities in the first phase of the project have been capped and will be put into production in the fourth quarter of 2023 according to normal planning. The project mainly carries out the research and development and production of FC-BGA, FC-CSP and RF packaging substrates. The project will achieve a "zero" breakthrough in FC-BGA substrates in China and fill the gap in the domestic semiconductor industry chain.